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Description
Ansys HFSS is a versatile 3D electromagnetic (EM) simulation tool used for the design and analysis of high-frequency electronic devices such as antennas, interconnects, connectors, integrated circuits (ICs), and printed circuit boards (PCBs). This powerful software allows engineers to create and evaluate a wide range of high-frequency electronic products, including antenna arrays, RF and microwave components, and filters. Renowned among engineers globally, Ansys HFSS is essential for developing high-speed electronics utilized in various applications like communication systems, advanced driver assistance systems (ADAS), satellites, and Internet of Things (IoT) devices. The software's exceptional performance and precision empower engineers to tackle complex challenges related to RF, microwave, IC, PCB, and electromagnetic interference (EMI) issues. With a robust suite of solvers, Ansys HFSS effectively addresses a myriad of electromagnetic challenges, making it an indispensable resource in the field of electronic design. As technology progresses, the relevance of such simulation tools becomes increasingly critical in ensuring optimal performance in modern electronic systems.
Description
The Ansys HPC software suite allows users to leverage modern multicore processors to conduct a greater number of simulations in a shorter timeframe. These simulations can achieve unprecedented levels of complexity, size, and accuracy thanks to high-performance computing (HPC) capabilities. Ansys provides a range of HPC licensing options that enable scalability, accommodating everything from single-user setups for basic parallel processing to extensive configurations that support nearly limitless parallel processing power. For larger teams, Ansys ensures the ability to execute highly scalable, multiple parallel processing simulations to tackle the most demanding projects. In addition to its parallel computing capabilities, Ansys also delivers parametric computing solutions, allowing for a deeper exploration of various design parameters—including dimensions, weight, shape, materials, and mechanical properties—during the early stages of product development. This comprehensive approach not only enhances simulation efficiency but also significantly optimizes the design process.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/electronics/ansys-hfss
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/it-solutions/hpc
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
Finite Element Analysis
Fluid Dynamics
Import / Export Files
Integrated 3D Modeling
Manufacturing Process Simulation
Mechanical Event Simulation
Multibody Dynamics
Thermal Analysis
PCB Design
3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor
