apmOptimizer Integrations

𝗕𝗤𝗥'𝘀 𝘀𝗼𝗳𝘁𝘄𝗮𝗿𝗲 𝘀𝘂𝗶𝘁𝗲 𝗽𝗿𝗼𝘃𝗶𝗱𝗲𝘀 𝗽𝗮𝘁𝗲𝗻𝘁𝗲𝗱 𝗮𝘂𝘁𝗼𝗺𝗮𝘁𝗲𝗱 𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰 𝗱𝗲𝘀𝗶𝗴𝗻 𝗮𝗻𝗮𝗹𝘆𝘀𝗶𝘀 𝗮𝗻𝗱 𝗼𝗽𝘁𝗶𝗺𝗶𝘇𝗮𝘁𝗶𝗼𝗻 𝘁𝗼𝗼𝗹𝘀 𝘁𝗼 𝘀𝘁𝗿𝗲𝗮𝗺𝗹𝗶𝗻𝗲 𝘆𝗼𝘂𝗿 𝗱𝗲𝘀𝗶𝗴𝗻𝘀: 𝗦𝘆𝗻𝘁𝗵𝗲𝗹𝘆𝘇𝗲𝗿𝗧𝗠 𝗘𝗖𝗔𝗗 𝗣𝗹𝘂𝗴𝗶𝗻 turbocharges PCB design with real-time stress analysis, derating, and thermal simulation. Its seamless integration into ECAD systems ensures optimal component selection and prevents costly errors. 𝗳𝗶𝗫𝘁𝗿𝗲𝘀𝘀® is your reliability engineering powerhouse. With advanced FMECA, stress, and failure predictions, you can extend product lifespan and minimize downtime. Combined with Synthelyzer™, it delivers unparalleled design optimization. 𝗖𝗶𝗿𝗰𝘂𝗶𝘁𝗛𝗮𝘄𝗸™accelerates time-to-market by detecting design flaws early in the process. Its advanced verification capabilities and stress analysis provide a robust foundation for reliable products. 𝗮𝗽𝗺𝗢𝗽𝘁𝗶𝗺𝗶𝘇𝗲𝗿® maximizes asset value and operational efficiency. Through LCC analysis and predictive maintenance, you'll reduce costs, optimize spare parts inventory, and ensure uninterrupted operations. 𝗖𝗔𝗥𝗘® ensures product safety and regulatory compliance. Our comprehensive

BQR’s fiXtress provides a powerful tool for electronic product reliability analysis. Derating analysis can identify components that are over-stressed or over-designed and may need to be changed. Stress-based MTBF predictions provide a realistic estimate for the mean time until product failure after derating analysis. FiXtress is an advanced Design for Reliability suite that can be added to any Electronic Design Automation tool. FiXtress modules are available as standalone modules or in combination with other modules to create a comprehensive DfR solution. Unique thermal analysis that estimates average temperature rise on the cold plate for accurate stress derating.

Easily perform electrical stress analysis, MTBF calculation, component derating, and FMECA analysis within your ECAD during board design. Key Features: • Uses cutting-edge AI technologies for robust and efficient design. *Seamless Integration with leading ECAD Software for streamlined workflows and real-time analyses. *Includes automated circuit strain calculators to speed up design processes. • Performs detailed analysis on electrical stress derivation for components. *Utilizes the results of thermal simulation to improve derating accuracy. *Provides thermal resistance and stress metrics for 3D Thermal Simulations. *Identifies EOS violations using Pareto analysis, and detailed reports on overstress and overdesign. *Recommends design changes to effectively resolve overstress problems. *Utilizes derating guidelines for optimal component performance. *Automates FMECA Analysis