Sigrity PowerDC Description
Cadence®, Sigrity™ PowerDC™, technology provides reliable DC analysis for signoffs of IC packages and PCB designs. This includes electrical/thermal cosimulation to maximize accuracy. PowerDC technology quickly detects areas of excessive IR drop and areas of high current density and thermal hotspots, minimizing your design's chance of failure. Automated setup of DC simulations using PowerTree™ data (source/sink définitions) captured at the schematic phase of the design process. Identifies highly resistive routing neck downs that are difficult to locate and determines which one of thousands will fail under stress. Determines whether it is possible to reduce the plane layers without increasing thermal reliability risk or DC. With a unique block-diagram results view and a variety of visualization options, this article considers what-if improvements.
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