Best Electronic Design Automation (EDA) Software in Asia

The Cadence AWR Design Environment Platform is a powerful tool that accelerates the development of RF/microwave products by enhancing engineering productivity and reducing turnaround time. This seamlessly integrated platform provides engineers with advanced high frequency circuit and system simulations coupled with in-design electromagnetic/thermal analyses to create manufacturing-ready high-frequency intellectual property. The user interface is intuitive and powerful, designed to increase engineering productivity. It offers smart, customizable designs flows that cater to today's high frequency semiconductor and PCB technologies. A unified design system facilitates front-to back physical design flow. Electrical and layout design entries can be dynamically linked to ensure that components placed into an electrical schematic will automatically generate a synchronized layout.

Microwave Office is a powerful tool for the design of passive components, such as filters, couplers and attenuators. It also supports active devices that operate under small-signal conditions, such as buffer amplifiers and low noise amplifiers. The linear configuration allows for simulation of S parameters (Y/Z/H/ABCD), linear stability, noise figure and return loss/voltage-standing-wave ratio (VSWR) as well as real time tuning, optimization and yield analysis. All E-series Microwave Office Portfolios include synchronous schematic/layout editors, 2D/3D viewer, libraries of high-frequency transmitted transmission models, surface mount vendor component RF model with footprints and measurement-based simulations. Microwave Office PCB supports analysis of RF/microwave systems with the APLAC HB Simulator and its powerful multirate HB, time-variant simulation engine and transient-assisted-HB.

Easily perform electrical stress analysis, MTBF calculation, component derating, and FMECA analysis within your ECAD during board design. Key Features: • Uses cutting-edge AI technologies for robust and efficient design. *Seamless Integration with leading ECAD Software for streamlined workflows and real-time analyses. *Includes automated circuit strain calculators to speed up design processes. • Performs detailed analysis on electrical stress derivation for components. *Utilizes the results of thermal simulation to improve derating accuracy. *Provides thermal resistance and stress metrics for 3D Thermal Simulations. *Identifies EOS violations using Pareto analysis, and detailed reports on overstress and overdesign. *Recommends design changes to effectively resolve overstress problems. *Utilizes derating guidelines for optimal component performance. *Automates FMECA Analysis

Overcome challenges of managing and integrating vast amounts of data