Follow Slashdot stories on Twitter


Forgot your password?
Check out the new SourceForge HTML5 internet speed test! No Flash necessary and runs on all devices. ×

Submission + - SPAM: Air Insulation coming to PCB

cgpirre writes: PORTLAND, Ore.—The holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level, according to the Semiconductor Research Corp. (SRC), a technology research consortium based in Research Triangle Park, N.C.
Ultra-low capacitance air-gaps on printed circuit boards—along with new solder-less copper connections—will allow higher frequency operation while simultaneously lowering power requirements, according to SRC's Focus Center research program and the Georgia Institute of Technology .

Link to Original Source

Slashdot Top Deals

An inclined plane is a slope up. -- Willard Espy, "An Almanac of Words at Play"