MojoKid writes: "In preparation for the arrival of their 3rd Generation Core processor products based on their Ivy Bridge microarchitecture, Intel has readied a new chipset dubbed the Z77 Express. New socket 1155 Ivy Bridge processors offer 16 lanes of PCI Express 2.0 or 3.0 connectivity on-die and they feature integrated dual-channel, DDR3 memory controllers with maximum officially supported speeds of up to 1600MHz. The processors are linked to the Z77 chipset via Intel’s FDI (Flexible Display Interface) and 20Gb/s DMI 2.0 interfaces. The chipset itself is outfitted with 8 more PCIe 2.0 lanes, six ports of SATA (II and III), an integrated Gigabit MAC, and digital display outputs for up to three displays. Making its debut for the first time in an Intel chipset is also native USB 3.0 support witih four USB 3.0 and ten USB 2.0 ports built in."
GMGruman writes: "For more than a year, Apple, Samsung, HTC, Motorola, Microsoft, and others have been engaged in hand-to-hand legal combat over patents used in mobile devices. At first, this seemed like standard corporate warfare, using patents as the equivalent of roadside bombs. But a series of court rulings over many months in several countries shows the war is about something much deeper: the abuse by (mainly) Android device makers of the patents used in standards, which are supposed to be open to all under fair licenses (called FRAND). Except this compromise between patent rights and open standards has been anything but honest, and the courts and even the E.U. and U.S. are beginning to take action. Ironically, although typically painted as the bad gut in the mobile patents fights, in the FRAND fight, it looks like Apple is the victim — one that hasn't been afraid to fight back."