Slashdot is powered by your submissions, so send in your scoop

 



Forgot your password?
typodupeerror
Get HideMyAss! VPN, PC Mag's Top 10 VPNs of 2016 for 55% off for a Limited Time ×
IBM

Submission + - 3D Chips with Internal Heat Pipes In Development (actualites.epfl.ch)

DanielRavenNest writes: Swiss researchers at EPFL and ETH Zurich are developing computer processors with stacked cores and internal 50 micron cooling channels that function like heat pipes, vaporizing the coolant and absorbing heat in the process. Thus it is literally vaporware :-) The article states "It will take a few years until 3D microchips equip consumer electronics. The initial 3D microprocessors should be fitted on supercomputers by 2015, while the version with an integrated cooling system should go to market around 2020." So it is vaporware in the other sense too, being 5-10 years out.

Slashdot Top Deals

panic: can't find /

Working...