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IBM

Submission + - 3D Chips with Internal Heat Pipes In Development (actualites.epfl.ch)

DanielRavenNest writes: Swiss researchers at EPFL and ETH Zurich are developing computer processors with stacked cores and internal 50 micron cooling channels that function like heat pipes, vaporizing the coolant and absorbing heat in the process. Thus it is literally vaporware :-) The article states "It will take a few years until 3D microchips equip consumer electronics. The initial 3D microprocessors should be fitted on supercomputers by 2015, while the version with an integrated cooling system should go to market around 2020." So it is vaporware in the other sense too, being 5-10 years out.

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