I used to run a PCBA factory. Here's what I'm seeing:
* The capacitor that's elevated at an angle is called a "tombstone". At least, think it's a cap - "CS" isn't a standard reference designator.
* Tombstones happen when uneven solder paste is applied, or improper heating is applied to the board during manufacturing, or the actual PCB design is crap, or the components are placed by a crap pick and place machine. So, one side of the component is pulled up by the surface tension of molten solder, as the other side hasn't melted yet.
* Wrong-sized components could exacerbate the situation, but I'm guessing that they're doing this to actually fix the situation (larger sizes may be less likely to exhibit this).
* There should be an inspection step in the manufacturing to catch defects like tombstones, before any "potting" is applied (like the epoxy shown). Such boards should be discarded or repaired.
* The potting happenedafter the heating step (called reflow, which melts the solder paste). That is entirely useless, as all they did was apply epoxy to defective electronics.
Our factory used to get a lot of bad designs, so we often just applied epoxy under certain components to prevent tombstones. Has the effect of gluing them down. It's called "staking".
* There should be an inspection step at the end, which again, should catch defects like tombstones. Such boards should be discarded. They can't be economically fixed after potting.
So, the upshot is that this manufacturing was outsourced to a factory with sloppy manufacturing, non-approved component substitutions, and zero quality control. OR the PCB design is terrible, and was not designed to prevent thermal gradients during manufacturing, and the factory had terrible habits on top.
This type of shoddiness is pretty shocking for a brand name like SanDisk, or Western Digital.