mattatwork writes: "According to the NY Times, IBM is set to announce a major advance in how it makes it chips. Using an unnamed substance, IBM expects faster and more energy efficient semiconductors. They also are using a newer technique of self-assembly, which has previously been used on the biological, Molecular (nano- and micro-scale) and Supramolecular. Instead of drilling holes (like in traditional chips), heat is used to create holes for substance X to be put through. Very cool process...though it does give me a headache thinking about it...."
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