vinsci writes: R&D company Novel Concepts, Inc. has announced its new IsoSkin heat spreader material that dissipates heat 20 times more effectively than copper, according to the company. The thin (down to 500 microns) IsoSkin spreaders could eventually be used to replace the outer "skin" of portable electronics, thereby eliminating the need for heat sinks and fans that cool notebooks and PCs, ExtremeTech reports.
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