judgecorp writes: Liquid cooling can be delivered up close to the processor, running through chips which are built in a 3D layers, according to researchers at EPFL university in Lausanne. The idea, under development for some years, requires fluid running in tiny micro-channels across the chip, some of it will boil, creating efficient "two-phase" cooling. The researchers are working on creating a two-phase where the cooling effect is not ruined by turbulence and hotspots.
"An idealist is one who, on noticing that a rose smells better than a
cabbage, concludes that it will also make better soup." - H.L. Mencken