judgecorp writes: Liquid cooling can be delivered up close to the processor, running through chips which are built in a 3D layers, according to researchers at EPFL university in Lausanne. The idea, under development for some years, requires fluid running in tiny micro-channels across the chip, some of it will boil, creating efficient "two-phase" cooling. The researchers are working on creating a two-phase where the cooling effect is not ruined by turbulence and hotspots.
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