Zothecula writes: A major obstruction to the development of practical 3D microchips is moving data and logic signals from one layer of circuitry to another. This can be done with conventional circuitry, but is quite cumbersome and generates a good deal of heat inside the 3D circuit. Physicists at the University of Cambridge have now developed a spintronic shift register that allows information to be passed between different layers of a 3D microchip.
IBM Advanced Systems Group -- a bunch of mindless jerks, who'll be first
against the wall when the revolution comes...
-- with regrets to D. Adams