alphadogg writes: A University of South Carolina researcher is touting a breakthrough regarding tin whiskers, tiny metal filaments that grow on data center floors and inside electronics from servers to smartphones, causing product problems via short circuits. The researcher says tin, or metal, whiskers are caused by stress within products, a problem that is likely to grow as devices shrink. "This [research] is a very big deal. As we move toward nano-scale devices, this is a problem that needs to be solved," says Xiaodong Li, a University of South Carolina professor.
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