Catch up on stories from the past week (and beyond) at the Slashdot story archive

 



Forgot your password?
typodupeerror
Check out the new SourceForge HTML5 internet speed test! No Flash necessary and runs on all devices. ×

Submission + - SPAM: Air Insulation coming to PCB

cgpirre writes: PORTLAND, Ore.—The holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level, according to the Semiconductor Research Corp. (SRC), a technology research consortium based in Research Triangle Park, N.C.
Ultra-low capacitance air-gaps on printed circuit boards—along with new solder-less copper connections—will allow higher frequency operation while simultaneously lowering power requirements, according to SRC's Focus Center research program and the Georgia Institute of Technology .

Link to Original Source
This discussion was created for logged-in users only, but now has been archived. No new comments can be posted.

Air Insulation coming to PCB

Comments Filter:

Programmers used to batch environments may find it hard to live without giant listings; we would find it hard to use them. -- D.M. Ritchie

Working...