I've been to Foxconn factories in Shenzen, and there are clearly opportunities for deeper automation. However, this will only be possible when the underlying hardware design has been designed for automation.
At the PCB level, pick and place achieves amazing automation and performance with smaller than rice-grain size components used in modern electronics. That is a given.
At the assembly level it isn't so easy to automate with a lot of the designs. There are flex cables, adhesive, torque sensitive screws that all rely on a human to be able to manipulate and then quickly respond to misalignment. To automate this, the design constraints placed on the Industrial Designs need to change. For low and mid-range products where form is not at the level of Apple integration, this will probably increase the automation. For the high end where every mm counts it's unlikely that there will be a high level of assembly automation.