Want to read Slashdot from your mobile device? Point it at m.slashdot.org and keep reading!

 



Forgot your password?
typodupeerror

Submission + - SPAM: Air Insulation coming to PCB

cgpirre writes: PORTLAND, Ore.—The holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level, according to the Semiconductor Research Corp. (SRC), a technology research consortium based in Research Triangle Park, N.C.
Ultra-low capacitance air-gaps on printed circuit boards—along with new solder-less copper connections—will allow higher frequency operation while simultaneously lowering power requirements, according to SRC's Focus Center research program and the Georgia Institute of Technology .

Link to Original Source

Slashdot Top Deals

fortune: cpu time/usefulness ratio too high -- core dumped.

Working...