Catch up on stories from the past week (and beyond) at the Slashdot story archive

 



Forgot your password?
typodupeerror

Submission Summary: 0 pending, 1 declined, 0 accepted (1 total, 0.00% accepted)

Slashdot videos: Now with more Slashdot!

  • View

  • Discuss

  • Share

We've improved Slashdot's video section; now you can view our video interviews, product close-ups and site visits with all the usual Slashdot options to comment, share, etc. No more walled garden! It's a work in progress -- we hope you'll check it out (Learn more about the recent updates).

×

+ - SPAM: Air Insulation coming to PCB

Submitted by cgpirre
cgpirre (1838252) writes "PORTLAND, Ore.—The holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level, according to the Semiconductor Research Corp. (SRC), a technology research consortium based in Research Triangle Park, N.C.
Ultra-low capacitance air-gaps on printed circuit boards—along with new solder-less copper connections—will allow higher frequency operation while simultaneously lowering power requirements, according to SRC's Focus Center research program and the Georgia Institute of Technology ."

Link to Original Source

"Right now I feel that I've got my feet on the ground as far as my head is concerned." -- Baseball pitcher Bo Belinsky

Working...