Follow Slashdot blog updates by subscribing to our blog RSS feed


Forgot your password?

Submission Summary: 0 pending, 1 declined, 0 accepted (1 total, 0.00% accepted)

Submission + - SPAM: Air Insulation coming to PCB

cgpirre writes: PORTLAND, Ore.—The holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level, according to the Semiconductor Research Corp. (SRC), a technology research consortium based in Research Triangle Park, N.C.
Ultra-low capacitance air-gaps on printed circuit boards—along with new solder-less copper connections—will allow higher frequency operation while simultaneously lowering power requirements, according to SRC's Focus Center research program and the Georgia Institute of Technology .

Link to Original Source

Retirement means that when someone says "Have a nice day", you actually have a shot at it.