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Submission Summary: 0 pending, 8 declined, 0 accepted (8 total, 0.00% accepted)

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Operating Systems

Submission + - Clans of the Alphane Moon

WindShadow writes: "In a recent article which mixed Microsoft, Asperger's, and Phillip K. Disk's Clans of the Alphane Moon Martin Heller talked about developers who can't stop working. In the 60's we called them "closet cases," people so strange you kept them in the closet and fed them through the keyhole. Now we use terms like Asperger's, which is PC, but doesn't reflect how strange some of these people are."
IBM

Submission + - IBM is using better thermal paste - so what?

WindShadow writes: I guess I'm missing the point... IBM is all excited at a better way to use thermal grease to cool CPUs, so they can be "smaller and faster." Isn't the objective to make them use less power?

I just spent 12 years (on a ten week contract) working in a big data center, and power use was a constant issue. Intel and AMD are making the CPUs deliver more performance per watt, and I'm really dubious that better cooling is going to be a big deal.

I'm old enough to remember SOS (Silicon On Saphire) and chips on diamond to get better cooling. I'm pretty sure the answer is not in more cooling, but in less power.

IBM

Submission + - IBM has a cool idea for hot chips

WindShadow writes: "InfoWorld reports in http://newsletter.infoworld.com/t?r=314&c=666660&l =3992&ctl=1496A9A:6C7ECD6E66ECD6C3576B8E1173E28883 EFF29049075316B4 on a new chip cooling technique offered by IBM, using a better layer of thermal paste between the chip and the heatsink. Another technique (under development) using water is also described."

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