Hate to tell you, K&S is not the leader in die bonding or wire bonding, but thats just from my observation in factories full of die bonders and wire bonders.
I design build and install backend semiconductor equipment, since the late 70's.
Back in the 1980's huge factories in Asia were installing the latest automated equipment. It was not unusual for us to install die bonders that were capable of 5k parts per hour per machine. In groups of 40 machines per device.
These were dedicated to a particular type of lead frame. But could mount multiple types of die. We had lines of 2N2222's at customers putting out over 20 million parts per week, all in a area the size of that room shown, including wire bonding. They had streamlined the whole process including injection molding, testing, and marking in a area only 5 times that room size. Before the automation there was 1000 girls per shift doing the same thing.
I was amazed that the Asian factories had such good automation compared to what I had see in factories here in the USA. But it was truly due to total volume. Here I NEVER saw a factory if the scale I would see there. Now I used to put this over to just labor, overhead cost etc in my mind back then. Later I would think it was due to regulation. Instead I now put it to foresight. They they knew if they could do it even 1/10 cent cheeper they would get the work. And if they got the work, it would never come back here to the USA. And they were right.
Led work is somewhat slower, especially those T1 frames they are using. They have to be handled vertically, and the spacing in between is large. So indexing time and centering of the cup takes a bit more work. Back when we did make machines for that product, the typical machine ran about 2K parts per hour. I am sure now, a bit faster indexing is possible. Thats why so many leds now are done on flat stock and molded and surface mounted, density and speed of manufacturing is much higher.
What they are showing is a cheep startup. Sales of led's by the container load are cheep, as it is a very stable process and anybody can do it. Where the problem comes in is manufacturing variables mostly in the wafer to have even appearing leds. Since the majority of leds are for human viewing, doing things like stop lights or where there are more than one led per product, we want them to appear the same, and look the same over time. So if you get led's from different lots they can appear to be different to the human eye. Especially if they are high output, as heat dissipation over time really degrades the device. That is also why they dont mount die directly to a PCB for stop lights. You can see if one die is different from the other, and while it is possible to adjust each die with a resistor, this adds another step, laser trimming of resistors using visual feedback. The cost of changing out a led made on a metal frame, and the cost of laser trimming is vast, when speed of manufacturing is involved. Much cheaper to just remove the leds and put another in, same for repair. If you pot a lens over a single pcb with multiple dies, it is no longer repairable.