" I would suggest Arctic Silver, first pre-treat both the CPU and the heatsink to get the paste into the tiny imperfections"
That isn't going to do you any good considering the ball size of the thermal compound components are larger than most imperfections on the surface of the heat sink and processor packaging (40 or so nm compared to the 15 or so nm of a heat sink.) This is why we're looking into carbon nanotube transfer pads, to fit into those very small imperfections and make for much better heat transfer and fewer air pockets to act as insulation.
"I also frankly don't put much stock in an "errata" that is only being seen by some guy running an EXTREMELY niche OS and then ONLY when he compiles with a certain version of GCC"
As I stated above, sounds like the n00b programmer just learned how to work with a crippled/biased year+ old compiler.