desktop cpu's typically dissipate ~50w at a moderate load (see http://en.wikipedia.org/wiki/List_of_CPU_power_dissipation for the maximum disapation of your favourite number cruncher)
the base of a heatsink is about 5cmx5cm (the actual die is quite a bit smaller than this), that's 50w/25cm2 or about 20 000w/m2.
at a temperature difference of around 100c, this generates .5w/m2.
Also, it's Seebeck coefficient of 1.5–2.2 mV K1 is 10x better than bismuth telluride (which has a Se of around 0.2 mV/K), (http://www.iue.tuwien.ac.at/phd/mwagner/node53.html). However, neither the Power Factor, nor Device Merit numbers are mentioned, and without those it is impossible to evaluate this material for suitability in high power operation, however the target audience and the power density of .5w/m2 seems to indicate that this could be more suited for low power density operations, rather than Active Cooling.
https://en.wikipedia.org/wiki/Thermoelectric_materials is an interesting relevent page ...