Comment Re:Go vertical! (Score 1) 168
There have been plenty of concept designs and current chips use 3d technology to an extent. The problem IS cooling. On a flat plane, you can simply put a piece of metal on top and it will cool it. Current chips sometimes stoke away close to 200W. With 3D designs, you need to build-in the heat transfer (taking up space you can't use for chips or communications) in between and both planes will produce equal amounts of heat so either heat transfer needs to be really, really good or you need a heat sink several times larger than the space you'd save in between the planes.