Comment Re:That's not news (Score 2, Interesting) 334
Hmmm. I read the linked article, and from the truly minimal amount
of hard information, it suggested that:
1) They're using some SOI process
2) They're using a laser ablation/etch process to define the cell boundaries
3) Each cell then has to be glued & connected, perhaps on a flexible substrate.
Brilliant! I mean, why bother using cheap, OTS silicon wafers, when you
can use expensive SOI, slice it up into tiny fragments with a laser, and
then throw cash at the packaging!
Yes, I am an OE engineer.
