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Submission + - 10 technologies to watch in 2011 (eetimes.com)

PabloSandoval48 writes: Ten technologies that EE Times editors think will generate buzz, attract developers and investors, and get end users to open their wallets in 2011 and beyond.
IBM

Submission + - IBM debuts CMOS silicon nanophotonics (eetimes.com)

PabloSandoval48 writes: Silicon chips will be communicating with pulses of light instead of electrical charge starting in 2011, according to International Business Machines Corp., which described its CMOS Integrated Silicon Nanophotonics technology Dec. 1 at the Semicon Japan trade show.

Submission + - Sandia upgrades supercomputer benchmarks (eetimes.com)

PabloSandoval48 writes: Exascale supercomputers running a thousand times faster than today's petaflop machines will require newer performance measures, according to Sandia National Laboratories, which announced a 30 member committee effort to define a new standard with Intel, IBM, AMD, NVIDIA, and Oracle. Called Graph 500, a preliminary specification has already been made available to supercomputer makers for testing.

Submission + - Nvidia describes 10 teraflops processor (eetimes.com)

PabloSandoval48 writes: Nvidia's chief scientist gave attendees at Supercomputing 2010 a sneak peak of a future graphics chip that will power an exascale computer. Nvidia's so-called Echelon system is just a paper design backed up by simulations, so it could change radically before it gets built. Elements of its chip designs ultimately are expected to show up across the company's portfolio of handheld to supercomputer graphics products.
Intel

Submission + - Inside Intel's Sandy Bridge architecture (eetimes.com)

PabloSandoval48 writes: Intel has officially entered the race to heterogeneous computer processors, sketching out the first members of its Sandy Bridge family that will ship before April. The 32nm chips will come in versions with two or four dual-threaded x86 cores and one graphics core on a shared ring interconnect.

The first Sandy Bridge parts are aimed at notebooks, desktops and single-socket servers. Versions with more cores aimed at multi-socket servers will follow later in the year or early in 2012.

Apple

Submission + - Opinion: Apple should build a fab (eetimes.com)

PabloSandoval48 writes: With Apple and its key foundry partner, Samsung Electronics, on a collision course in several end-user markets, Apple should consider building its own semiconductor fab to build the A4 processor that powers its iPad and iPhone.
Intel

Submission + - Hot Chips: Inside AMD's two new x86 cores (eetimes.com)

PabloSandoval48 writes: A peak inside AMD's Bulldozer and Bobcat cores provides a glimpse at the competitive landscape in x86 processors in 2011 and beyond. The first x86 cores designed from a clean sheet of paper in 10 years will form the underpinning of most of the products AMD will build over the next five to 10 years to compete with archrival Intel in everything from data center servers to ultrathin netbooks.

Submission + - How to make next-gen media tablet an iPad killer (eetimes.com)

PabloSandoval48 writes: Whatever you prefer to call the newest category of portables--smartbooks, media tablets, iPad clones or touchscreen tablets--the astounding popularity of these devices speaks to the societal sea change under way in how we use computers and consume content.
Iphone

Submission + - Poor antenna design may cause iPhone 4 issue (eetimes.com)

PabloSandoval48 writes: Some users are experiencing cellular reception problems with the Apple iPhone 4 that one analyst said could be due to Apple's novel use of the smartphone's frame as an antenna. Apple acknowledged the problem in a statement advising users on how to hold the phone. One teardown expert speculated the problem may be due to what appears to be Apple's decision to embed the phone's cellular and GPS antennas in the metal frame of the case.

Submission + - IceCube telescope takes shape below Antarctic ice (eetimes.com)

PabloSandoval48 writes: The world’s largest telescope, currently under construction more than a mile beneath the Antarctic ice, is on schedule to be completed next year, according to a researcher at the University of Wisconsin, the lead institution for a scientific project called IceCube.
Iphone

Submission + - First look inside iPhone 4 reveals high reuse (eetimes.com)

PabloSandoval48 writes: A teardown analysis by UBM TechInsights reveals that at least seven chips found inside Apple's iPade are also in the new iPhone 4 smartphone. As had been speculated, STMicroelectronics won a coveted design win for its MEMS gyro in the handset.

Submission + - Why engineers don't like Twitter (eetimes.com)

PabloSandoval48 writes: A recent EE Times survey of 285 engineers found that 85 don’t use Twitter. More than half indicated that the statement “I don’t really care what you had for breakfast,” best sums up their feelings about it.

Submission + - Apple's A4 dissected, discussed...and tantalizing (eetimes.com)

PabloSandoval48 writes: Apple's A4 pr4ocessor is heavily influenced by Apple's long established relationship with Samsung and represents an evolution rather than a revolution in circuit design. A team of experts takes a look at the evidence on A4 in an attempt to determine its origins and the influence of recent Apple acquisitions in the area of chip design.

Submission + - 60 GHz Wi-Fi groups face off in Beijing (eetimes.com)

PabloSandoval48 writes: In meetings in Beijing this week, engineers are hammering out the future of Wi-Fi. The IEEE 802.11ad group is essentially a replay of a long standing conflict between two opposing camps in 60 GHz wireless technology. But the two camps—consumer electronics vendors supporting WirelessHD and chip vendors making up the Wireless Gigabit Alliance apparently reached a compromise before the meetings even began. A draft 802.11ad standard is promised for September.
Iphone

Submission + - Next-gen iPhone could cost Apple $170 (eetimes.com)

PabloSandoval48 writes: The next-generation Apple iPhone could have a bill of materials cost between $169 to $175, a significant increase from $156 for the current iPhone 3GS, according to an analysis from UBM TechInsights, based in part from pictures and videos on the Internet of what appear to be next-generation iPhone handsets.

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