Comment Fabless (Score 5, Interesting) 120
Where I think AMD really fell behind was they were not able to afford the kind of R&D on the manufacturing side that Intel does for each new process. AMD basically gave up and is now in the same boat as the rest of the "fabless" companies being 100% dependent on what TSMC or Global Foundries can produce. This is always going to put you at a competitive disadvantage at the very high end. While intel is working on pushing down to 22nm FINFET for the "old" architecture people in the design group are without a doubt working on 16nm and getting sample silicon at this node so they can tune their designs for what the transistors will really look like. When you go fabless you get to figure this out with poor yields while in "manufacturing" at the foundry. Maybe at 130 -65nm this wasn't such a big deal but when you need to make your design work with double or tripple patterned 193nm immersion lithography just figuring out some design rules is no simple task.
Also does anyone know if there is more than 1 vendor in the world that can make fully depleted SOI of the quality needed for 32nm - 28nm on a 300mm wafer? Last I knew this was a major reason behind Intel pushing FINFET instead of the fully depleted SOI.