Intel Experimenting With Nanotubes 85
illeism writes "C|Net is reporting on Intel's experimentation with nanotubes in processors. From the article: 'The chip giant has managed to create prototype interconnects — microscopic metallic wires inside of chips that link transistors ... Carbon nanotubes ... conduct electricity far better than metals. In fact, nanotubes exhibit what's called ballistic conductivity, which means that electrons are not scattered or impeded by obstacles.'"
Quantum Dots (Score:5, Interesting)
3D Microprocessors (Score:5, Interesting)
Besides, it would look like a Borg cube under a microscope. How cool is that?!?
Re:Nanotubes good conductors of heat (Score:3, Interesting)
I'm not sure what is used in processors currently, but having the links as nanotubes would help the heat transfer within the material also. Nanotubes have a thermal conductivity of around 2000-3000 W/m/K at normal CPU operating temperatures. This is a huge increase when you compare it to the 149 W/m/K for silicon and 318 W/m/K for gold at room temperature.
So the increase in thermal conductivity by just having a proportion of the CPU made from nanotubes could possibly be enough to make up for the shape change. I wouldn't have thought much power would be saved by using nanotubes over any other conductor though. I'd be guessing most of the power loss is in the silicon gates, but I might be wrong.
http://www.pa.msu.edu/cmp/csc/ntproperties/thermal transport.html [msu.edu] Carbon Nanotube Thermal Conductivity
http://en.wikipedia.org/wiki/Silicon [wikipedia.org] Silicon Thermal Conductivity
http://en.wikipedia.org/wiki/Gold [wikipedia.org] Gold Thermal Conductivity
Re:3D Microprocessors (Score:2, Interesting)
I've read that, like 3d microprocessors, memory dies have often been stacked one on top of another (in slower DDR, DDR2 and NAND flash memory). The stacking allows good performance capacity upgrades with limited space; it's more cost effective! If Stacked memory dies sandwich a memory controller, the closer and faster operation would solve a big problem of distance latencies found in the cooperation of single memory dies embedded far apart on a flat circuit board with a memory controller. I could see a mainstream purely stacked memory chip. And if the nanotube interconnect idea works, it could be well implemented in both smaller individual dies and stacked ones.
Re:Power is Heat (Score:4, Interesting)
The excellent heat-transfer of nanotubes, plus the efficient water flow through them would make cooling them much better than current chips.