3-D Flexible Computer Chips

Roland Piquepaille writes "Engineers at the University of Wisconsin-Madison have isolated a single-crystal film of semiconductor from the substrate on which it is built. Then they transferred this very thin film — 200 nanometers thick — on plastic. Both sides of the film can host active components and several layers can be stacked, opening the way to very powerful 3-D flexible computer chips. Besides computer chips, this technique could be used for solar cells, smart cards, RFID tags or active-matrix flat panel displays."

Re:This is new .. how?

[Anonymous Coward]

Did you read the articles or the pdf's you sent? These are completely different processes. Not only are the products of the transfer very flexible in the new process but they can also be stacked which is certainly not achievable in the second and maybe not in the first, although it doesn't specifically say. Are you just trolling?