3-D Flexible Computer Chips 85
Roland Piquepaille writes "Engineers at the University of Wisconsin-Madison have isolated a single-crystal film of semiconductor from the substrate on which it is built. Then they transferred this very thin film — 200 nanometers thick — on plastic. Both sides of the film can host active components and several layers can be stacked, opening the way to very powerful 3-D flexible computer chips. Besides computer chips, this technique could be used for solar cells, smart cards, RFID tags or active-matrix flat panel displays."
Heat dissipation..... not a major issue (Score:2, Informative)
This is new .. how? (Score:5, Informative)
First two paper hits I found in google:
http://retina.et.tudelft.nl/data/artwork/publicat
http://retina.et.tudelft.nl/data/artwork/publicat
Many companies are also working on substrate transfer processes to build silicon wafers with selective crystal orientation. Among them IBM and Soitec.